Job Description

Description

Job Summary:

Seeking a well-qualified and highly professional Project Engineer to lead new product development projects for an onsemi business unit. The selected individual will be responsible for managing multiple programs that involve the development qualification and release of new products as well as IP and technology development projects. This person must also manage our new product package technology roadmap. This person will be an expert in leading cross-functional teams managing program costs and meeting project deadlines to maximize the ROI for new product releases. This person will have a strong background in analyzing data to support decision making and in presenting meaningful analysis that demonstrates the conclusions clearly to others. This leadership position requires continual interactions with both internal and external business executives to ensure the project outputs align to the organization from senior executives to entry-level employees. This person will have a broad range of semiconductor industry experience and be able to fill in the gaps between different functional areas such as manufacturing engineering finance R&D and operations.

Responsibilities:

• Define development program requirements with stakeholders
• Manage several key development programs in parallel from across different program types: new product development transfers IP development and cost savings
• Lead development efforts for our new product package technology roadmap
• Lead cross-functional teams to ensure that development projects complete on schedule and within budget parameters
• Create project plans with measurable objectives an achievable schedule minimized risks and budget to align with the business case
• Resolve problems encountered during the project development by consulting technical experts and aligning resources to remove roadblocks
• Track document and report each programs performance against the original project plan identify and address gaps proactively assess and mitigate risks and communicate comprehensive status to stakeholders and senior management

Requirements:

• Minimum Bachelors degree in engineering of science prefer electrical or electronics
• 5 years of semiconductor experience (new product introduction cost savings transfers manufacturing flow specification application cost quality) and execution management experience
• 5 project management experience or in roles with strong project management component PMP certified is a plus
• 3 years of packaging development or package manufacturing engineering
• Strong financial acumen
• Flexible in changing market environments customer oriented
• Proficiency in MS Excel Excel Macro Power Point 8D RCCAs Lessons learned.
• Able to travel and attend morning or evening conference calls

Competencies:

• Expert knowledge of packaging technologies for discrete and analog product lines
• Waterfall program management methodologies tools and capabilities
• Excellent leadership skills to guide performance of program team members
• Data gathering and analysis to understand gaps and issues in processes and tools
• Broad cross-functional experience in semiconductor manufacturing is highly valuable
• Highly proficient in Excel and PowerPoint
• Able to take large sets of data analyze data form opinions about data and make recommendations to management
• Apply a variety of data extraction and analytic techniques to answer a wide range of business questions.

Skills:

• Leadership with ability to operate independently handle changing priorities and achieve deadlines
• Management of cross functional cross disciplined teams with members outside of direct authority
• Team player with strong listening skills that can take inputs and make informed decisions
• Concise and clear communication skills both written and oral plus strong interpersonal skills

Required Experience:

IC

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